Electronic device soldering
TPT HB100 semi-automatic bonder
Description of the services offered
Making electrical connections with metal wires in different materials and with different micron in diameter. The contact can be made in the shape of a ball or flat.
Needs requested and applications
The equipment is used to join any kind of electronic device to any type of base or set of pads
Sector or area of application
Electronics and optoelectronics
Differential skills
Previous references for provision of services
Equipment description
ISOM. HTSE Telecommunications
